BOND MEISTER MWB-04/06/08 AX | BOND MEISTER MWB-04/06/08 AX – Nidec Machine Tool America | NMTA Skip to content
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BOND MEISTER MWB-04/06R

BOND MEISTER MWB-04/06/08-AX — the high-performance solution for mass production, engineered to balance high throughput with exceptional process flexibility. This model streamlines large-scale manufacturing by utilizing cassette-to-cassette processing, allowing for the continuous bonding of 10-set batches. With fully automated transport and alignment, operators simply load the wafers and initiate the cycle for hands-free, end-to-end execution.

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Machine Information

The MWB-04/06/08-AX is powered by robust recipe management, enabling unique parts and process conditions to be configured for every individual set. This makes it equally effective for high-mix, low-volume production runs that require rapid adaptation. For specialized requirements, the system supports custom jigs for bonding diverse wafer and chip geometries, while optional AB gun activation and post-bond heating/pressurizing chambers ensure maximum reliability for even the most demanding metal-to-metal applications.

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Specifications

ItemSpecs
Set wafer10 sets
Wafer size100 mm/150 mm/200 mm
OperationFully-automatic/Semi-automatic
Alignment accuracy±2 μm (MHI Machine Tools measured value (Note: Measured data values are not guaranteed values.))
Surface activationIon gun/FAB gun
Pressure welding mechanismMax. 100 kN
AlignmentBy IR transparent image
Degree of chamber vacuum<1.0 × 10^-5 Pa
UtilityArgon gas, nitrogen gas, compressed air
Power supply (200 V, 100 V)

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