BOND MEISTER MWB-08/12-ST | BOND MEISTER MWB-08/12-ST – Nidec Machine Tool America | NMTA Skip to content
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BOND MEISTER MWB-08/12-ST

BOND MEISTER MWB-08/12-ST — the definitive solution for 300 mm room-temperature wafer bonding, specifically engineered for the 3D stacking of advanced ICs, memory, and high-volume CMOS image sensor production. By eliminating the need for thermal cycles, the MWB-08/12-ST bypasses the traditional challenges of mismatched thermal expansion coefficients, ensuring superior alignment accuracy across a vast spectrum of materials—from standard silicon and compound semiconductors to gold, copper, and monocrystal oxides.

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Machine Information

The MWB-08/12-ST is built for high-throughput environments where speed and precision are non-negotiable. Its fully automated cassette-to-cassette system handles everything from transport to alignment with a single push of a button, while a sophisticated recipe management system allows for the seamless, automated processing of mixed-part batches. For applications requiring extreme force, such as specialized metal-to-metal bonding, the machine features a high-load pressure welding mechanism capable of delivering up to 200 kN (20 tonnes) of force, providing the reliability needed for the most demanding 3D-stacked device architectures.

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Specifications

ItemSpecs
Set wafer5 sets (max.)
Wafer size300 mm/200 mm
OperationFully-automatic/Semi-automatic
Alignment accuracy±2 μm (MHI Machine Tools measured value (Note: Measured data values are not guaranteed values.))
Surface activationArgon fast atom beam
Pressure welding mechanismMax. applied load 200 kN
AlignmentBy IR transparent image
Degree of chamber vacuum<1.0 × 10^-5 Pa
UtilityArgon gas, nitrogen gas, compressed air
Power supply (200 V, 100 V)

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