BOND MEISTER MWB-04/06-R | BOND MEISTER MWB-04/06-R – Nidec Machine Tool America | NMTA Skip to content
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BOND MEISTER MWB-04/06R

BOND MEISTER MWB-04/06R — the versatile standard for high-precision bonding across a wide range of applications. From initial research and device prototyping to small and medium-volume production, the MWB-04/06R delivers consistent results by processing in precise single-bond units. This model achieves high throughput and semi-automation, making it an ideal solution for scaling up device manufacturing.

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Machine Information

The MWB-04/06R features comprehensive all-in-one support for transport and alignment functions, paired with an intuitive PC-based interface designed for immediate operation from day one. With the ability to utilize special jigs, it offers the flexibility to bond wafers and chips of varying shapes, supporting a diverse array of materials and advanced device architectures.

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Specifications

ItemSpecs
Set wafer1 set
Wafer size100 mm/150 mm
OperationSemi-automatic
Alignment accuracy±2 μm (MHI Machine Tools measured value (Note: Measured data values are not guaranteed values.))
Surface activationIon gun
Pressure welding mechanismMax. 20 kN
AlignmentBy IR transparent image
Degree of chamber vacuum<1.0 × 10^-5 Pa
UtilityArgon gas, nitrogen gas, compressed air
Power supply (200 V, 100 V)

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