Model: LAMDA200

Description: Laser powder directed energy deposition additive manufacturing machine with three, four or five CNC axes. 200 X 200 X 200 mm work envelope.

Features: High accuracy, user-friendly interface, and durable design.

Model: LAMDA500

Description: Laser powder directed energy deposition additive manufacturing machine with five CNC axes. 500 X 500 X 500 mm work envelope.

Features: High accuracy, user-friendly interface, and durable design.

Model: LAMDA2000

Description: Hybrid laser powder directed energy deposition additive manufacturing machine with subtractive machining capabilities. 2,000 x 1,500 x 1,000 mm work envelope.

Features: High precision, innovative control systems, and robust design.

Model: LAMDA5000

Description: Large-scale laser powder directed energy deposition additive manufacturing system for oversized metal components. 5,000 x 2,500 x 1,600 mm work envelope.

Features: Simultaneous 5-axis DED, real-time melt pool monitoring, AI anomaly detection, and local shielding nozzle.

Model: ABLASER

Description: Ultra-precise laser micromachining system for advanced material processing applications.

Features: High-precision laser processing, compact design, and advanced control system.

Model: MWB-04/06R

Description: Room temperature wafer bonding machine for precision semiconductor applications.

Features: High bonding accuracy, compact footprint, and advanced process control.

Model: MWB-04/06/08AX

Description: Room temperature wafer bonding machine with expanded wafer size compatibility.

Features: Multi-size wafer support, high precision alignment, and advanced bonding control.

Model: MWB-08/12-ST

Description: Large-scale room temperature wafer bonding machine for 8 and 12 inch wafers.

Features: Large wafer handling, ultra-high bonding precision, and automated process control.